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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC4742 SINGLE SUPPLY VOLTAGE, HIGH SPEED, WIDE BAND, DUAL OPERATIONAL AMPLIFIERS The PC4742 is dual high speed, wide band operational amplifier designed for single supply operation from +3 V to +32 V with low supply current drain. By using high speed PNP transistors for input and output circuits, the excellent AC performance is achieved without degrading capacitive load drive capability. With no crossover distortion and wide output voltage range characteristics, the PC4742 is optimum choice for single supply AC amplifier, and active filters. FEATURES * High slew rate: 7 V/s TYP. (V+ = +5 V, V- = GND) * Wide gain band width product: 3.5 MHz TYP. (V+ = +5 V, V- = GND) * Wide supply voltage range: +3 V to +32 V * Wide output voltage swing * Common mode input voltage range includes V- * Internal frequency compensation * Output short circuit protection EQUIVALENT CIRCUIT (1/2 Circuit) V+ Q7 Q8 Q9 Q10 Q11 PIN CONFIGURATION (Top View) PC4742C, 4742G2 Q12 OUT1 1 8 V+ -+ 1 Q2 II IN Q1 Q3 Q4 Q18 Q19 OUT II1 2 +- 7 OUT2 2 IN1 3 6 II2 Q14 Q20 V- 4 5 IN2 Q5 V- Q6 Q13 Q15 Q16 Q17 ORDERING INFORMATION Part Number Package 8-pin plastic DIP (300 mil) 8-pin plastic SOP (225 mil) PC4742C PC4742G2 The information in this document is subject to change without notice. Document No. G13958EJ1V0DS00 (1st edition) Date Published December 1998 N CP(K) Printed in Japan (c) 1998 PC4742 ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Parameter Voltage between V+ and V- Note 1 Differential Input Voltage Input VoltageNote 2 Output VoltageNote 3 Power Dissipation C PackageNote 4 G2 Output Short Circuit PackageNote 5 Symbol V+ -V- VID VI VO PT Ratings -0.3 to +36 36 V- -0.3 to V- +36 V- -0.3 to V+ +0.3 350 440 Indefinite TA Tstg -20 to +80 -55 to + 125 Unit V V V V mW mW sec C C DurationNote 6 Operating Ambient Temperature Storage Temperature Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction independent of the magnitude of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is -5.0 mW/C when operating ambient temperature is higher than 55 C. 5. Thermal derating factor is -4.4 mW/C when operating ambient temperature is higher than 25 C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage (Split) Supply Voltage (V- = GND) Output Current Capacitive Load (AV = +1, Rf = 0 ) V Symbol MIN. 1.5 +3 TYP. MAX. 16 +32 10 1000 Unit V V mA pF V+ IO CL 2 PC4742 ELECTRICAL CHARACTERISTICS (TA = 25 C, V = 15 V) Parameter Input Offset Voltage Input Offset Current Input Bias CurrentNote 7 Large Signal Voltage Gain Supply Current Common Mode Rejection Ratio Supply Voltage Rejection Ratio Output Voltage Swing Symbol VIO IIO IB AV ICC CMR SVR Vom RL 10 k RL 2 k RL 2 k, VO = 10 V IO = 0 A, Both Amplifiers 70 70 13.7 13.5 V AV = 1, RL 2 k fO = 100 kHz f = 20 Hz to 20 kHz - Conditions MIN. TYP. 1.0 6 140 MAX. 4.5 75 500 Unit mV nA nA 25000 300000 4.3 86 93 +14 -14.3 5.5 mA dB dB V Output Voltage Swing Common Mode lnput Voltage Range Slew Rate (Rise) Gain Band Width Product Channel Separation Vom VICM SR GBW V V -1.8 8.5 3.5 120 + V V/s MHz dB ELECTRICAL CHARACTERISTICS (TA = 25 C, V+ = 5 V, V- = GND) Parameter Input Offset Voltage Input Offset Current Input Bias CurrentNote 7 Large Signal Voltage Gain Supply Current Common Mode Rejection Ratio Supply Voltage Rejection Ratio Output Voltage Swing Symbol VIO IIO IB AV ICC CMR SVR Vom RL 2 k (Connect to GND) RL 2 k IO = 0 A, All Amplifiers 70 70 3.7 0 0 V V + + IN IN Conditions MIN. TYP. 1.0 6 160 MAX. 5 75 500 Unit mV nA nA 25000 300000 3.3 80 95 4.0 0 V+-1.8 30 30 7 4.5 mA dB dB V Common Mode lnput Voltage Range Output Current (SOURCE) Output Current (SINK) Slew Rate (Rise) VICM IO SOURCE IO SINK SR = +1 V, V = 0 V, V - IN V mA mA V/s =0V 10 10 - IN = +1 V Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage. 3 PC4742 TYPICAL CHARACTERISTICS (TA = 25 C, TYP.) POWER DISSIPATION 500 10 SUPPLY CURRENT V+ A 8 200 C/W ICC - Supply Current - mA PC4742G2 PT - Total Power Dissipation - mW ICC 400 PC4742C - + 6 V- 4 TA = -20 C TA = +25 C TA = +80 C 300 227 C/W 200 100 2 0 20 40 60 80 100 0 5 10 15 20 TA - Operating Ambient Temperature - C V - Supply Voltage - V INPUT OFFSET VOLTAGE 5 4 VIO - Input Offset Voltage - mV VICM - Common Mode Input Voltage Range - V COMMON MODE INPUT VOLTAGE RANGE 40 V = 15V 3 2 1 0 -1 -2 -3 -4 -5 -50 0 50 100 30 20 VICM+ 10 VICM- 0 + 10 20 - 30 40 TA - Operating Ambient Temperature - C INPUT BIAS CURRENT 200 200 V - Supply Voltage - V (V = GND) INPUT BIAS CURRENT IB - Input Bias Current - nA 100 IB - Input Bias Current - nA 150 100 50 0 + 10 20 - 30 40 V = 15V 0 -50 0 50 100 V - Supply Voltage - V (V = GND) TA - Operating Ambient Temperature - C 4 PC4742 OUTPUT SINK CURRENT LIMIT 10 V+ = 15 V 5 V+ = 15 V V /2 4 + - + OUTPUT SOURCE CURRENT LIMIT V+ VO IO SOURCE 1 VO - Output Voltage to V+ - V VO - Output Voltage - V 3 V+ V+/2 0.1 + - IO SINK VO RL 2 1 0.01 0.01 The dotted line shows a characteristic of RL = 1 k 0.1 1.0 10 100 0 0.01 0.1 1.0 10 100 IO SINK - Output Sink Current - mA IO SOURCE - Output Source Current - mA OPEN LOOP FREQUENCY RESPONSE 120 V = 15 V 30 LARGE SIGNAL FREQUENCY RESPONSE V = 15 V RL = 2 k AV - Open Loop Voltage Gain - dB 100 Vom - Output Voltage Swing - Vp-p 80 20 60 40 10 20 0 100 0 10 100 1k 10 k 100 k 1 M 10 M 1k 10 k 100 k 1M 10 M f - Frequency - Hz f - Frequency - Hz VOLTAGE FOLLOWER PULSE RESPONSE 12 SLEW RATE VIN - Input Voltage -V/VO - Output Voltage - V 3 2 1 0 RL = 2 k V+ = +5 V V- = GND 10 SR - Slew Rate - V/ s SR- 8 SR+ 6 3 2 1 0 0 1 2 3 4 2 V = 15 V RL = 2 k 0 -50 0 50 100 t - Time - s TA - Operating Ambient Temperature - C 5 PC4742 PACKAGE DRAWINGS 8PIN PLASTIC DIP (300 mil) 8 5 1 A I 4 K P L J H G F D N M C B M R NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. ITEM A B C D F G H I J K L M N P R MILLIMETERS 10.16 MAX. 1.27 MAX. 2.54 (T.P.) 0.500.10 1.4 MIN. 3.20.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 7.62 (T.P.) 6.4 0.25 +0.10 -0.05 0.25 0.9 MIN. 0~15 INCHES 0.400 MAX. 0.050 MAX. 0.100 (T.P.) 0.020 +0.004 -0.005 0.055 MIN. 0.1260.012 0.020 MIN. 0.170 MAX. 0.200 MAX. 0.300 (T.P.) 0.252 0.010 +0.004 -0.003 0.01 0.035 MIN. 0~15 P8C-100-300B,C-1 6 PC4742 8 PIN PLASTIC SOP (225 mil) 8 5 detail of lead end P 1 A 4 H F G I J S B E D NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. L K N S C M M ITEM A B C D E F G H I J K L M N P MILLIMETERS 5.2 +0.17 -0.20 0.78 MAX. 1.27 (T.P.) 0.42 +0.08 -0.07 0.10.1 1.590.21 1.49 6.50.3 4.40.15 1.10.2 0.17 +0.08 -0.07 0.60.2 0.12 0.10 +7 3 -3 S8GM-50-225B-5 7 PC4742 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "Semiconductor Device Mounting Technology Manual" (C10535E). Type of Surface Mount Device PC4742G2: 8-pin plastic SOP (225 mil) Process Infrared ray reflow Conditions Peak temperature: 230 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 1 time. Peak temperature: 215 C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 1 time. Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Partial heating method Pin temperature: 300 C or below, Heat time: 3 seconds or less (Per each side of the device). - Symbol IR30-00-1 Vapor Phase Soldering VP15-00-1 Wave Soldering WS60-00-1 Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device PC4742C: 8-pin plastic DIP (300 mil) Process Wave soldering (only to leads) Partial heating method Conditions Solder temperature: 260 C or below, Flow time: 10 seconds or less. Pin temperature: 300 C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 8 PC4742 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL NEC IC PACKAGE MANUAL (CD-ROM) GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES SEMICONDUCTORS SELECTION GUIDE NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM (STANDARD LINEAR IC) C11531E C10535E C13388E MEI-1202 X10679E IEI-1212 9 PC4742 [MEMO] 10 PC4742 [MEMO] 11 PC4742 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 |
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